The core of the 5G era cannot be bypassed by semiconductor chips. The 1G to 5G mobile communication innovation is generally an upgrade of software and hardware, and silicon carbide, as a new third-generation semiconductor material, contributes to the development of 5G mobile communications.

Among the key materials in the 5G era, ceramic materials will also do a lot. So, when silicon carbide is used as a ceramic material, can it take a share in the 5G era? Combining the key material characteristics of the 5G era and the performance of silicon carbide ceramics, here is a brief discussion on the possible applications of silicon carbide ceramics in the 5G era.
Applications of silicon carbide ceramics in the 5G era:

(1) Electromagnetic shielding materials for mobile phones: In the 5G era, the size and spacing of the internal chips of smart phones are getting smaller and smaller. It can be said that the degree of integration and signal transmission density are high; this leads to more serious electromagnetic interference inside the mobile phone, so the electromagnetic shielding material for mobile phones It is an indispensable part of smart phones in the 5G era. According to reports, the silicon carbide ceramic composite material has absorbing properties, coupled with its low density and high mechanical strength, it is expected to be a small and lightweight absorbing device inside 5G smart phones.
(2) Heat conduction and heat dissipation materials for mobile phones: In the 5G era, smartphones have become more powerful due to their more powerful functions. As a result, the integration and density of chips and modules inside mobile phones has increased, leading to a sharp increase in heat production during semiconductor devices. One of the key reasons for the failure of semiconductor devices is caused by heat. Therefore, it is very urgent to develop well-matched thermal and heat dissipation materials.

In terms of thermal and heat dissipation ceramics, alumina ceramics is currently the most mature material. However, alumina ceramics still has the disadvantage of low thermal conductivity and large difference in thermal expansion coefficient of semiconductor chips. It is easy to accumulate internal stress and cause chip failure, so it is difficult to adapt to the requirements of thermal conductivity and heat dissipation materials in the 5G era.

The silicon carbide ceramic has high thermal conductivity, low thermal expansion coefficient and high matching degree with the chip thermal expansion coefficient; in addition, if the chip material uses the latest generation of silicon carbide semiconductor in the 5G era, the thermal expansion coefficient matching degree tends to be perfect. Therefore, silicon carbide ceramics have a good prospect in the field of heat and heat dissipation materials for mobile phones in the 5G era.
Silicon carbide ceramics has a series of excellent properties, making its application range more and more extensive, whether it is in modern industry, even aerospace, national defense and security. Therefore, the application of silicon carbide ceramics in the 5G era is also essential.